摘 要
随着工业4.0的深入推进，自动化包装生产线作为现代制造业的重要组成部分，其高效性与智能化水平成为提升生产效率和产品质量的关键因素。本文以机电一体化技术为核心，探讨其在自动化包装生产线中的应用，旨在通过多学科交叉融合优化传统包装工艺，实现高精度、高速度和低能耗的目标。研究基于系统工程理论，结合传感器技术、控制理论、计算机科学以及机械工程等多领域知识，构建了一套完整的机电一体化包装解决方案。具体方法包括采用先进的伺服控制系统实现精准定位，利用视觉检测技术确保产品包装质量，并通过物联网平台实现数据实时采集与分析。实验结果表明，该方案能够显著提高包装生产线的运行效率，降低故障率，同时减少人工干预需求。此外，本文提出的模块化设计思路为不同规模企业提供了灵活的定制化选择，增强了系统的适应性和扩展性。创新点在于首次将深度学习算法引入包装缺陷检测环节，大幅提升了检测准确率；同时开发了基于边缘计算的实时监控系统，有效解决了传统系统中数据处理延迟的问题。研究表明，机电一体化技术的应用不仅推动了包装行业的技术革新，还为智能制造领域的进一步发展提供了有益借鉴，具有重要的理论价值和实践意义。关键词：机电一体化技术；自动化包装生产线；深度学习算法；边缘计算；系统工程理论
Abstract
With the deepening advancement of Industry 4.0, automated packaging production lines, as a critical component of modern manufacturing, have become key factors in enhancing production efficiency and product quality through their high efficiency and intelligent capabilities. This paper focuses on mechatronics technology and explores its application in automated packaging production lines, aiming to optimize traditional packaging processes through interdisciplinary integration to achieve ob jectives of high precision, high speed, and low energy consumption. Based on systems engineering theory, the study incorporates knowledge from multiple domains, including sensor technology, control theory, computer science, and mechanical engineering, to develop a comprehensive mechatronics-based packaging solution. Specific methodologies include the implementation of advanced servo control systems for precise positioning, the utilization of vision inspection technology to ensure packaging quality, and the employment of an Internet of Things (IoT) platform for real-time data collection and analysis. Experimental results demonstrate that this solution significantly improves the operational efficiency of packaging production lines, reduces fault rates, and minimizes the need for manual intervention. Furthermore, the modular design approach proposed in this paper offers flexible customization options for enterprises of varying scales, enhancing the adaptability and scalability of the system. The innovation lies in the first-time introduction of deep learning algorithms into the packaging defect detection process, which substantially increases detection accuracy, as well as the development of a real-time monitoring system based on edge computing, effectively addressing data processing latency issues in traditional systems. The research indicates that the application of mechatronics technology not only drives technological innovation in the packaging industry but also provides valuable insights for further advancements in the field of smart manufacturing, possessing significant theoretical and practical implications..
Key Words：Mechatronics Technology；Automation Packaging Production Line；Deep Learning Algorithm；Edge Computing；System Engineering Theory
目 录
摘 要 I
Abstract II
第1章 绪论 1
1.1 研究背景与意义 1
1.2 国内外研究现状分析 1
1.3 本文研究方法与技术路线 2
第2章 机电一体化技术基础及包装生产线需求分析 3
2.1 机电一体化技术的核心构成 3
2.2 自动化包装生产线的技术需求 3
2.3 机电一体化在包装生产线中的适配性分析 4
2.4 关键技术难点与解决方案探讨 4
2.5 技术应用的可行性评估 5
第3章 机电一体化技术在包装生产线中的具体应用 6
3.1 运动控制技术在包装设备中的实现 6
3.2 检测与传感技术在质量监控中的作用 6
3.3 工业机器人在包装流程中的集成应用 7
3.4 数据采集与处理技术提升生产效率 7
3.5 系统优化设计与实际案例分析 8
第4章 机电一体化技术对包装生产线的影响与未来发展 9
4.1 提升包装生产线自动化水平的效果分析 9
4.2 对生产成本与经济效益的影响评估 9
4.3 技术融合对行业发展的推动作用 10
4.4 当前应用存在的问题与改进建议 10
4.5 未来发展趋势与潜在研究方向 11
结 论 11
参考文献 13
致 谢 14
