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高分子复合材料的制备与性能研究

摘    要

  高分子复合材料因其优异的性能在众多领域展现出广阔的应用前景,传统材料难以满足现代工业对高性能、多功能材料的需求,促使研究人员不断探索新型高分子复合材料。本研究旨在制备具有特定性能的高分子复合材料并深入探究其性能表现。以聚酰胺6为基体材料,添加不同质量分数的碳纳米管作为增强相,采用熔融共混法成功制备了一系列高分子复合材料。通过扫描电子显微镜观察复合材料的微观形貌,发现碳纳米管在基体中分散较为均匀,且随着碳纳米管含量增加,复合材料的拉伸强度和弹性模量均呈现先增大后减小的趋势,在质量分数为3%时达到最大值,较纯聚酰胺6分别提高了45%和60%,这主要归因于碳纳米管与基体之间形成了良好的界面结合。此外,还研究了复合材料的热性能,差示扫描量热法结果显示复合材料的玻璃化转变温度有所提高,热重分析表明其热稳定性也得到增强。

关键词:高分子复合材料  聚酰胺6  碳纳米管


Abstract 
  Because of their excellent properties in many fields, traditional materials are difficult to meet the needs of modern industry for high-performance and multi-functional materials, prompting researchers to continuously explore new polymer composite materials. The present study aims to prepare polymer composites with specific properties and explore their performance performance. A series of polymer composites were successfully prepared by melting blending by using polyamide 6 as matrix material and adding carbon nanotubes with different mass fractions as enhancement phase. By scanning electron microscope observe the microscopic morphology of composite materials, found that carbon nanotubes in the matrix dispersed more uniform, and with the increase of carbon nanotubes content, the tensile strength and elastic modulus of the composite decreases, in the mass fraction of 3%, than pure polyamide 6 increased by 45% and 60% respectively, this is mainly attributed to form a good interface between carbon nanotubes and the matrix. In addition, the thermal properties of the composite were also investigated, and the differential scanning calorimetry results showed an increased glass transition temperature of the composite, and the thermal weight analysis showed an enhanced thermal stability.

Keyword:Polymer Composite Materials  Polyamide 6  Carbon Nanotubes


目  录
1绪论 1
1.1高分子复合材料研究背景与意义 1
1.2国内外研究现状综述 1
1.3本文研究方法与技术路线 1
2高分子复合材料的制备工艺 2
2.1原材料选择与预处理 2
2.2复合材料成型方法 3
2.3制备过程中的关键参数控制 3
2.4新型制备技术探索 4
3高分子复合材料的性能表征 4
3.1力学性能测试与分析 4
3.2热性能评价方法 5
3.3电学性能研究 5
3.4耐腐蚀性能测试 6
4高分子复合材料的应用前景 6
4.1在航空航天领域的应用 7
4.2在汽车工业中的应用 7
4.3在电子器件中的应用 8
4.4应用面临的挑战与展望 8
结论 9
参考文献 10
致谢 11

 
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