摘要
随着电子技术的快速发展，电子设备在复杂环境下的可靠性问题日益凸显，成为制约其性能与寿命的关键因素。本研究旨在深入探讨电子电路的可靠性设计与分析方法，以提升电子系统在极端条件下的稳定性和适应性。研究基于现代可靠性理论，结合实际工程需求，提出了一种集成化可靠性设计框架，该框架融合了故障模式与影响分析（FMEA）、加速寿命试验（ALT）以及多物理场仿真技术，能够有效评估和优化电路在高温、高湿及电磁干扰等复杂工况下的表现。通过引入机器学习算法对历史数据进行挖掘与预测，进一步提升了可靠性评估的精度与效率。实验结果表明，所提出的综合设计方法可显著降低电路失效概率，并延长其使用寿命。此外，本研究还开发了一套适用于小型化、集成化电子器件的可靠性测试平台，为相关领域的工程实践提供了有力支持。主要创新点在于将智能化手段与传统可靠性分析相结合，实现了从单一指标到多维度评价的转变，同时为未来电子电路的设计优化提供了新的思路与技术参考。研究成果不仅有助于提高电子产品的整体可靠性，也为推动相关行业的技术进步奠定了坚实基础。
关键词：电子电路可靠性；集成化设计框架；故障模式与影响分析
Abstract
With the rapid development of electronic technology, the reliability of electronic devices in complex environments has become increasingly prominent, becoming a critical factor that constrains their performance and lifespan. This study aims to thoroughly investigate the design and analysis methods for the reliability of electronic circuits to enhance the stability and adaptability of electronic systems under extreme conditions. Based on modern reliability theory and combined with practical engineering requirements, an integrated reliability design fr amework is proposed, which incorporates Failure Mode and Effects Analysis (FMEA), Accelerated Life Testing (ALT), and multiphysics simulation techniques. This fr amework can effectively evaluate and optimize circuit performance under complex operating conditions such as high temperature, high humidity, and electromagnetic interference. By introducing machine learning algorithms for data mining and prediction of historical records, the accuracy and efficiency of reliability assessment are further improved. Experimental results indicate that the proposed comprehensive design approach significantly reduces the probability of circuit failure and extends its service life. Additionally, this research develops a reliability testing platform tailored for miniaturized and integrated electronic devices, providing strong support for engineering practices in related fields. The primary innovation lies in the integration of intelligent methodologies with traditional reliability analysis, achieving a transition from single-metric evaluation to multidimensional assessment. This not only offers new insights and technical references for the optimization of future electronic circuit designs but also contributes to enhancing the overall reliability of electronic products. The research findings lay a solid foundation for advancing technological progress in relevant industries.
Keywords：Electronic Circuit Reliability; Integrated Design fr amework; Fault Mode And Effects Analysis
目 录
摘要 I
Abstract II
一、绪论 1
(一) 电子电路可靠性研究背景与意义 1
(二) 国内外研究现状分析 1
(三) 本文研究方法与技术路线 2
二、电子电路可靠性设计基础理论 2
(一) 可靠性设计的基本概念与原则 2
(二) 关键参数对可靠性的影响分析 3
(三) 常见可靠性设计方法概述 3
(四) 设计中的容错机制研究 4
三、电子电路可靠性分析方法研究 5
(一) 可靠性分析的主要模型与工具 5
(二) 故障模式与影响分析 5
(三) 基于仿真的可靠性评估技术 6
(四) 环境因素对可靠性的定量分析 6
四、电子电路可靠性优化策略研究 7
(一) 可靠性优化的设计流程探讨 7
(二) 元器件选择对可靠性的影响 7
(三) 温度管理与热设计优化研究 8
(四) 生命周期内的可靠性提升方法 8
结 论 10
参考文献 11
随着电子技术的快速发展，电子设备在复杂环境下的可靠性问题日益凸显，成为制约其性能与寿命的关键因素。本研究旨在深入探讨电子电路的可靠性设计与分析方法，以提升电子系统在极端条件下的稳定性和适应性。研究基于现代可靠性理论，结合实际工程需求，提出了一种集成化可靠性设计框架，该框架融合了故障模式与影响分析（FMEA）、加速寿命试验（ALT）以及多物理场仿真技术，能够有效评估和优化电路在高温、高湿及电磁干扰等复杂工况下的表现。通过引入机器学习算法对历史数据进行挖掘与预测，进一步提升了可靠性评估的精度与效率。实验结果表明，所提出的综合设计方法可显著降低电路失效概率，并延长其使用寿命。此外，本研究还开发了一套适用于小型化、集成化电子器件的可靠性测试平台，为相关领域的工程实践提供了有力支持。主要创新点在于将智能化手段与传统可靠性分析相结合，实现了从单一指标到多维度评价的转变，同时为未来电子电路的设计优化提供了新的思路与技术参考。研究成果不仅有助于提高电子产品的整体可靠性，也为推动相关行业的技术进步奠定了坚实基础。
关键词：电子电路可靠性；集成化设计框架；故障模式与影响分析
Abstract
With the rapid development of electronic technology, the reliability of electronic devices in complex environments has become increasingly prominent, becoming a critical factor that constrains their performance and lifespan. This study aims to thoroughly investigate the design and analysis methods for the reliability of electronic circuits to enhance the stability and adaptability of electronic systems under extreme conditions. Based on modern reliability theory and combined with practical engineering requirements, an integrated reliability design fr amework is proposed, which incorporates Failure Mode and Effects Analysis (FMEA), Accelerated Life Testing (ALT), and multiphysics simulation techniques. This fr amework can effectively evaluate and optimize circuit performance under complex operating conditions such as high temperature, high humidity, and electromagnetic interference. By introducing machine learning algorithms for data mining and prediction of historical records, the accuracy and efficiency of reliability assessment are further improved. Experimental results indicate that the proposed comprehensive design approach significantly reduces the probability of circuit failure and extends its service life. Additionally, this research develops a reliability testing platform tailored for miniaturized and integrated electronic devices, providing strong support for engineering practices in related fields. The primary innovation lies in the integration of intelligent methodologies with traditional reliability analysis, achieving a transition from single-metric evaluation to multidimensional assessment. This not only offers new insights and technical references for the optimization of future electronic circuit designs but also contributes to enhancing the overall reliability of electronic products. The research findings lay a solid foundation for advancing technological progress in relevant industries.
Keywords：Electronic Circuit Reliability; Integrated Design fr amework; Fault Mode And Effects Analysis
目 录
摘要 I
Abstract II
一、绪论 1
(一) 电子电路可靠性研究背景与意义 1
(二) 国内外研究现状分析 1
(三) 本文研究方法与技术路线 2
二、电子电路可靠性设计基础理论 2
(一) 可靠性设计的基本概念与原则 2
(二) 关键参数对可靠性的影响分析 3
(三) 常见可靠性设计方法概述 3
(四) 设计中的容错机制研究 4
三、电子电路可靠性分析方法研究 5
(一) 可靠性分析的主要模型与工具 5
(二) 故障模式与影响分析 5
(三) 基于仿真的可靠性评估技术 6
(四) 环境因素对可靠性的定量分析 6
四、电子电路可靠性优化策略研究 7
(一) 可靠性优化的设计流程探讨 7
(二) 元器件选择对可靠性的影响 7
(三) 温度管理与热设计优化研究 8
(四) 生命周期内的可靠性提升方法 8
结 论 10
参考文献 11
